Company overview
UNISOC is a global platform-based chip design company with comprehensive expertise in 2G/3G/4G/5G, Wi-Fi, RedCap, Bluetooth, television/FM broadcasting and satellite communications. It is one of three 5G smartphone chip suppliers in the global open market. Large-scale chip integration and chipset capabilities support mobile processors, baseband chips, RF front-end chips, RF chips and other communications, computing and control chips. Field testing covers more than 140 countries and regions, with shipment certification from over 270 operators. More than 500 brand customers include HONOR, Xiaomi, realme, vivo, Samsung, Motorola, Hisense, ZTE, JD.com, UnionPay and Gree.
UNISOC has received National Science and Technology Progress Awards including one special prize and two first prizes, and filed over 11,000 patent applications covering 3G/4G/5G, multiple-SIM multiple-standby and multimode technologies. The source lists 5,000 employees, with R&D personnel exceeding 85%.
Ma Daojie — Executive Vice President of New Unigroup and Chairman of UNISOC
Ma holds a communications engineering bachelor's degree from Beijing University of Posts and Telecommunications, a master's degree in information and communications management from the Norwegian School of Management, and a business administration doctorate from Rennes School of Business. He received a national science and technology first prize and a State Council special government allowance. Previous roles: Deputy General Manager, China Unicom Guangxi; Deputy General Manager, Unicom Huasheng Communications Technology; General Manager, Tianyi Telecom Terminals and China Telecom Mobile Terminal Management Center; Vice Chairman, China Telecom trade union; Vice President, Lenovo, and Executive Vice President of its China mobile business. Joining New Unigroup in December 2017, he successively served as Executive Vice President, President, Vice Chairman and President, and Chairman and President of Unigroup Guoxin Microelectronics, while chairing Unigroup Storage, Hongmao and Liansheng. The source lists his current positions as New Unigroup Executive Vice President and Unigroup Guoxin Microelectronics Vice Chairman.
Dr. Ren Qiwei — Executive Vice President of New Unigroup and CEO of UNISOC
A semiconductor expert and senior engineer at the highest professional grade, Ren holds bachelor's and master's degrees from Tsinghua University and a doctorate from Delft University of Technology, all in microelectronics. He has more than 20 years of IC technology and business management experience. He was a senior engineer and project leader at Philips Semiconductors in the Netherlands, then Design Director at Qimonda's Xi'an R&D center. In 2009 he helped Inspur acquire and restructure the center into Xi'an Huaxin Semiconductor, serving as General Manager and concurrently Senior Vice President of Shandong Huaxin Semiconductor. Following acquisition and renaming by New Unigroup in 2015, he became General Manager of Xi'an Unigroup Guoxin Semiconductor. He also served as Vice President of Unigroup Guoxin Microelectronics, CEO of Beijing Unigroup Storage Technology and Chairman of related subsidiaries. As project leader and chief expert he led national major science and technology research on core electronic components, high-end general-purpose chips and basic software, and national 863 Program projects.