Company overview
The source describes Hongxing Technology Co., Ltd. as a high-tech electronic component and semiconductor packaging/test company headquartered in China. It explicitly leaves the city to be supplied, suggesting Shenzhen or Suzhou as examples. This location requires confirmation. Applications cover consumer electronics, communications, automotive and industrial control.
Packaging/testing: QFN, BGA, SiP and flip-chip for memory, power devices, sensors and RF chips, plus wafer probing (CP) and final testing (FT). Components: MLCCs, inductors, resistors and modules for smart terminals and automotive electronics.
Industry solutions: high-frequency/high-integration packaging for 5G bases/terminals; automotive AEC-Q100/Q200 packaging including MCUs/power modules; miniature low-power AIoT and wearable packaging.
The source lists HDI/3D packaging capabilities, intelligent automated inspection, ISO 9001/IATF 16949 and some military-standard products. Customers include domestic/international fabless companies, IDMs and terminal brands. Foundry/material cooperation optimizes cost and lead times.