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Founded June 28, 2017, with RMB 415 million registered capital, Huayi Microelectronics is a high-tech Huatian Electronics Group subsidiary for power semiconductor R&D/design, packaging/test and sales. Site: 8928 Shangji Road, Xi'an Economic and Technological Development Zone, 200.8 mu. Core strengths are wafer design and packaging/test processes.
Products
20–150 V low/medium-voltage MOSFETs include surge-resistant trench and high-frequency/high-dynamic shielded-gate trench (SGT) devices. Over 400 products are mass-produced for EVs, automotive electronics, 5G bases, power tools, storage and consumer electronics, particularly motor drives and battery storage.
Eleven packaging series: TO-220, TO-220F, TO-262, TO-263, PPAK, DPAK, IPAK, TO-3P, TO-247, TO-264 and IPM, with over 60 outlines for diodes, transistors, MOSFETs, superjunction MOSFETs, IGBTs and modules.
Technology/quality
Independently controlled technologies support reliable high-power products, innovation, application design and complete technical/after-sales service. Source systems: ISO 9001, IATF 16949, ISO 14001, ISO 45001, OQC080000, ESD S20.20, SONY GP and AQAS. Over 76 IP assets include patents, software and IC layouts.
Municipal laboratory/technology center; 2021 provincial/municipal gazelle, industrial R&D and Qinchuangyuan Innovation Center recognition; 2022 Xi'an Hard Technology Enterprise Star; 2023 China Chip Emerging Product award for HYG007N03LS1C2 and CNAS accreditation.
Total project investment: RMB 5.8 billion. Forecast at full operation: annual output at least RMB 6 billion, 12 billion units and RMB 300 million tax. Priorities include excellence, innovation, automotive devices/modules, customer/market focus and employee development.
Separate page figures list over 400 product types, 4.8 billion annual units, 67 invention patents and 59 utility-model patents. These differ in scope from preceding totals and need reconciliation.
