Beijing, China, August 7, 2025 — Murata China, a leading global manufacturer of electronic components, participated today in the 2025 Open Compute Innovation Technology Conference, OCP China Day. In line with the conference theme ‘Open Transformation: Foundation, Expansion and Evolution,’ Murata showcased power supplies, inductors, sensors and new integrated package solutions. Murata's innovative technologies and products were once again recognized by OCP with the Best Open Compute Innovation Award. Murata remains committed to supporting greener development and efficient operation of data centers.
Award ceremony
Rapid advances in cloud services, AI and the Internet of Things are increasing data centers' computing and electricity requirements, creating an urgent need for more efficient, stable power solutions. Murata offers OCP-compliant power solutions for AI products: ORV3 HPR-compliant power shelves for entire racks, mCRPS power modules and multistage power products for UBB baseboards and OAM accelerator modules. This diverse, complete and convenient portfolio supports OCP product manufacturers, especially those developing AI applications, in high performance computing and intelligent applications.
At this conference, Murata highlighted power modules, noise suppression components and sensors to meet growing demand for energy efficiency as data center technology advances.
Power supply and battery solutions
Murata's power products support OCP-based power architectures. The MWOCES-191-P-D*1 is a 33 kW, 19-inch, 1RU, ORV3-compatible power shelf accommodating up to six 67 mm 1U PSU units and one remote management unit (RMU). The MWOCP67-5500-B-RM*2 is an efficient ORV3 front-end PSU with a 50.5 V / 5.5 kW output and peak efficiency above 97.5%. Murata also presented power distribution units, M-CRPS power modules, DC/DC power bricks and cylindrical lithium-ion cells, offering comprehensive, stable power solutions from power management to battery cells.
*1 Under development. Specifications and appearance may change without notice.
*2 Under development. Specifications and appearance may change without notice.
Integrated package solutions*3
Designed for high performance power modules and semiconductor packaging applications, Murata's integrated package solutions embed capacitors and inductors in circuit boards to reduce power distribution network (PDN) impedance. The embedded capacitors' through-hole interconnections support vertical power delivery architectures, improving efficiency, board layout and power integrity. Suitable for power modules up to 1,000 A and high performance IC packages, the solutions can be widely used in servers, AI accelerators, optical modules and other end devices sensitive to power consumption and space. Their modular design supports system miniaturization and energy-efficient operation in data centers and computing platforms.
*3 Reference products. Specifications and appearance may change without notice.
Inductor portfolio for optoelectronic applications
Murata's Bias-T inductors offer excellent broadband insertion loss performance for high speed optical transceivers and other applications with demanding high frequency response requirements, balancing performance with efficient use of space. Its DC/DC buck inductors address requirements for compact size, low height (T = 0.8 mm maximum) and high current capability. Murata also presented compact, high performance LC filtering solutions for switch optical interfaces and BLE-series ferrite beads for high current applications in network equipment and base stations. This diverse portfolio meets the evolving needs of network communications equipment.
Barometric pressure sensors
Murata also exhibited barometric pressure sensing devices. Based on capacitive MEMS technology, its barometric pressure sensors combine waterproofing, low noise and high precision with temperature compensation and tilt detection, making them particularly suitable for water cooling systems.
At the Intelligent Computing Infrastructure Forum, Murata senior power product specialist Yang Ning delivered a presentation entitled ‘Murata Power Solutions: Efficient Support for OCP Products,’ sharing Murata's distinctive innovations. He said: ‘As global digital transformation accelerates, data center power requirements and operational demands are becoming more complex. As one of the few global suppliers able to integrate power solutions starting with battery cells and capacitors, Murata reinforces production and quality control at the component level. Our diverse solutions enjoy a strong industry reputation for quality and brand reliability, making power selection much easier for OCP customers. As an OCP member, Murata is committed to technological innovation and to providing efficient, stable power solutions and electronic components. By continuously improving product quality and technology, we help customers gain a competitive advantage and provide solid support for the sustainable development of data center businesses.’
Through continual innovation, Murata will develop smarter, greener and more stable electronic components and solutions for global customers, contributing to the sustainable development of a digital society.